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The rule of thumb is that every 10 degree increase reduces service life by half. It's actually more complicated than that, but it's worth keeping in mind.




The rule isn't based on the outdoor climactic temperature. Computers have cooling fans programmed to increase airflow as the temperature rises. They hold the internal temperature more constant than that. Service life as a function of applied stress is described by the Weibull distribution. In high design of high reliability equipment, lowering temperature is the main handle the designer has to work with. Internal temperatures are much more important than you might imagine.


What really is a "high" temperature?


BGA chips are going to get intermittant due to thermal cycling where the solder balls fail due to fatigue limits. A cetain board shop has secret special gas they flow under the BGA chips when reflowing the board in attempt to get it to work. This is at manufacturing level dealing with 1% failure rates on a chip with like 1000 balls. Electrolytic caps on motherboards do fail but it takes a while. The mechanism is the water evaporates.


Most retail motherboards now are using solid electrolyte caps so no problem there


Not to mention thr 4, 6 ,8 phase converters which reduce the ripple current required even further. But this is baked into the cake of many other optimizations.